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                黃石廠簡介

                1.Geographical location Hubei(HuangShi)

                2.Site Overview

                3.Function of Quality Assurance

                4.Capability

                Item Technology and Capability
                Layers 2~14 layers
                Board thickness 16mil~126mil(0.4~3.2mm)
                working panel size.(Max) 610*712mm (24*28 inch)
                Material Mid-Tg Phenolic & HF, High-TgPhenolic, FR4 & HF FR4,Mid Loss
                core dielectric thickness (Min) 3mil(75μm)
                Line width/spacing Inner layer:3mil/3mil(H OZ);Outer layer:3.5mil/3.5mil(Copperfoil H OZ)
                Inner layer copper thickness(Max) 5 OZ
                Drilling Hole Diameter (Min) 0.20mm
                Aspect ratio (DHS) (Max) 12:1
                Outer Layer Process Pattern plating
                Surface Metal Finish ENIG,OSP,HASL(leaded),GoldFinger,ENIG+OSP,OSP+GoldFinger
                Special Process Back Drilling,POFV,Buried Vias,Segmented Gold Finger ,etc

                5.Technology Support

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                蘇ICP備10211191號